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UID:submissions.supercomputing.org_SC18_sess275_exforum117@linklings.com
SUMMARY:Specifying Rack Level High Density Liquid Cooling Solutions
DESCRIPTION:Exhibitor Forum\nHPC Center Planning and Operations\n\nSpecify
 ing Rack Level High Density Liquid Cooling Solutions\n\nWood\n\nThe higher
  the density of heat generating equipment, the higher the risk of any fail
 ure resulting from inadequate rack, row and room level cooling.  Presentin
 g rack level cooling design considerations and methods for managing high h
 eat loads in HPC applications.  Passive or active rear door solutions offe
 r an efficient way of cooling up to 45kW per rack.  Whereas, the hot exhau
 st air from the rack-mounted equipment passes through a passive door mount
 ed cooling coil and water circuit – an integrated fan assembly delivers ad
 ditional CFM in active cooling configurations.  When optimizing the heat t
 ransfer, the coil layout and optimized air/water circuit temperatures can 
 improve cooling performance. Some HPC configurations can generate even hig
 her heat loads and may require high-density liquid-to-liquid cooling as an
  ideal alternative – both chip and system level. Additionally, it is essen
 tial to deploy reliable monitoring of working parameters as well as leak d
 etection along the pipework.
URL:https://sc18.supercomputing.org/presentation/?id=exforum117&sess=sess2
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