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DTSTART;TZID=America/Chicago:20181114T160000
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UID:submissions.supercomputing.org_SC18_sess275_exforum117@linklings.com
SUMMARY:Specifying Rack Level High Density Liquid Cooling Solutions
DESCRIPTION:Michael Wood (nVent)\n\nThe higher the density of heat generat
 ing equipment, the higher the risk of any failure resulting from inadequat
 e rack, row and room level cooling.  Presenting rack level cooling design 
 considerations and methods for managing high heat loads in HPC application
 s.  Passive or active rear door solutions offer an efficient way of coolin
 g up to 45kW per rack.  Whereas, the hot exhaust air from the rack-mounted
  equipment passes through a passive door mounted cooling coil and water ci
 rcuit – an integrated fan assembly delivers additional CFM in active cooli
 ng configurations.  When optimizing the heat transfer, the coil layout and
  optimized air/water circuit temperatures can improve cooling performance.
  Some HPC configurations can generate even higher heat loads and may requi
 re high-density liquid-to-liquid cooling as an ideal alternative – both ch
 ip and system level. Additionally, it is essential to deploy reliable moni
 toring of working parameters as well as leak detection along the pipework.
 \n\nTag: HPC Center Planning and Operations\n\nSession Chair: John Blaas (
 National Center for Atmospheric Research (NCAR))\n\n
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