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DTSTART:19700308T020000
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DTSTART;TZID=America/Chicago:20181114T153000
DTEND;TZID=America/Chicago:20181114T160000
UID:submissions.supercomputing.org_SC18_sess275_exforum130@linklings.com
SUMMARY:The Case for Thermoplastic Quick Disconnects in Liquid Cooling
DESCRIPTION:Kristin Anderson (Colder Products Company)\n\nLiquid cooling s
 ystem components must meet requirements for chemical compatibility, flow r
 ates, temperature/pressure exposures. Ease of use and reliability over lon
 g periods of time are additional desirable attributes. To avoid potential 
 damage to expensive electronic equipment due to leaks, secure drip-free co
 nnections are essential for any liquid cooling system.\n \nQuick disconnec
 ts (QDs) designed and built specifically for HPC applications are now avai
 lable, simplifying connector selection. However, questions surface around 
 component materials – metal or thermoplastics and their ability to meet HP
 C thermal requirements. Intended use, ease of installation and maintenance
 , operating conditions, durability, and potential for leakage have bearing
  on the selection process. \n\nThis presentation describes the performance
  and reliability factors of thermoplastics for fluid handling. The differe
 nces between thermoplastic and metal fluid connectors are discussed. Speci
 al focus is given to sealability, integrity over time, condensation/corros
 ion, chemical compatibility and weight. The presentation highlights CPC’s 
 just-announced thermoplastic quick disconnect products.\n\nTag: HPC Center
  Planning and Operations\n\nSession Chair: John Blaas (National Center for
  Atmospheric Research (NCAR))\n\n
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